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MSE's RM90 Mln Matching Fund Launched To Position M'sia As Advanced Semiconductor Packaging Hub

KUALA LUMPUR, July 17 (Bernama) -- Malaysia’s Science Endowment matching fund for the semiconductor sector amounting to RM90 million, has been launched to position the country as a global hub in advanced packaging technology, an area currently dominated by a handful of countries such as Taiwan.

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