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There are 23 news based on search keyword " advanced packaging"

Govt Has Secured More Than RM63 bln Investments Through NSS As Of March 2025

PETALING JAYA, July 24 (Bernama) -- The government has secured more than RM63 billion of investments under the National Semiconductor Strategy (NSS) as of March this year, with RM5 billion from domestic sources and RM58 billion from foreign sources, said Prime Minister Datuk Seri Anwar Ibrahim.

MSE's RM90 Mln Matching Fund Launched To Position M'sia As Advanced Semiconductor Packaging Hub

KUALA LUMPUR, July 17 (Bernama) -- Malaysia’s Science Endowment matching fund for the semiconductor sector amounting to RM90 million, has been launched to position the country as a global hub in advanced packaging technology, an area currently dominated by a handful of countries such as Taiwan.

Malaysia’s Leadership Sought To Spearhead ASEAN Semiconductor Industry Alliance

By Nur Athirah Mohd Shaharuddin

KUALA LUMPUR, May 22 (Bernama) -- Semiconductor industries within Southeast Asia must join forces to compete as a united bloc to elevate ASEAN’s collective role in the global semiconductor value chain.

MIDA Introduces Two Programmes At SEMICON SEA 2025 To Boost International Partnerships

KUALA LUMPUR, May 21 (Bernama) -- Malaysia Investment Development Authority (MIDA) introduced two strategic programmes at SEMICON South East Asia (SEA) 2025 to accelerate industry growth and foster international partnerships.

Nearfield Instruments, A*STAR IME To Advance AI Chip Metrology In Singapore

KUALA LUMPUR, May 21 (Bernama) -- Nearfield Instruments, a leader in advanced semiconductor metrology, has entered a multi-year research collaboration with Singapore’s A*STAR Institute of Microelectronics (A*STAR IME) to drive innovation in semiconductor metrology technologies.

Malaysia, Arm Rev Up IC Design Capabilities For Local Companies Via Engagement Session

PUCHONG, May 6 (Bernama) -- The Malaysia Semiconductor IC Design Park, in collaboration with the semiconductor company Arm, today kicked off its engagement session with over 20 local companies in its effort to shift Malaysia towards front-end integrated circuit (IC) microchip design. 

PM Anwar Wants NCIA To Seize Opportunities To Strengthen Semiconductor Industry

KUALA LUMPUR, March 6 (Bernama) -- The Northern Corridor Implementation Authority (NCIA) must seize the opportunity to empower the development of the semiconductor industry in advanced packaging (AP) following the collaboration between the government and Arm Holdings Plc.

PM's Involvement Seals MIDA-Arm Holdings Strategic Cooperation

By Nurunnasihah Ahmad Rashid

KUALA LUMPUR, March 5 (Bernama) — Negotiations between Malaysia and Arm Holdings Plc, which have been finalised, represent an important step in strengthening the country's semiconductor ecosystem and accelerating the development of local technology, said Investment, Trade, and Industry Minister Tengku Datuk Seri Zafrul Abdul Aziz.

NVIDIA’s Investments Relevant, Strengthens Malaysia's Position In Chip Supply Chain - Expert

KUALA LUMPUR, Jan 10 (Bernama) -- NVIDIA's significant investments in Malaysia are relevant for the country, as the company focuses on specialised chip architectures, strengthening Malaysia’s position in the global chip supply chain, said an expert.

Globetronics Shares Rally In Early Trade After Taiwan Deal

KUALA LUMPUR, Nov 22 (Bernama) -- Globetronics Technology Bhd shares on Bursa Malaysia surged in the early session after the company entered into a strategic partnership with Taiwan-based ChipMOS Technologies Inc for integrated circuit services.

Malaysia Needs To Prepare And Have All The Buffers To Face The Changing Global Economic Environment -- BNM Governor

KUALA LUMPUR, Oct 26 (Bernama) -- Malaysia, as a small and open economy, needs to ensure that it is well-prepared and has the necessary buffers to face the changing global economic environment, said Bank Negara Malaysia (BNM) governor Datuk Seri Abdul Rasheed Ghaffour.