KUALA LUMPUR, March 12 (Bernama) -- The Malaysian Rubber Glove Manufacturers Association (MARGMA) and Monash University Malaysia have signed a memorandum of understanding (MoU) to strengthen talent development, research collaboration, and innovation within Malaysia’s rubber glove industry.
By Fatin Umairah Abdul Hamid and Nur Athirah Mohd Shaharuddin
KUALA LUMPUR, March 8 (Bernama) -- The privatisation of Digital Nasional Bhd (DNB) is expected to reduce the government’s financial liabilities and associated risks as the 5G network deployment transitions from a policy-driven phase to a fully commercial stage, according to an industry expert.
KUALA LUMPUR, March 4 (Bernama) -- The Ministry of Science, Technology and Innovation (MOSTI) through MIMOS Bhd is focusing on integrated circuit (IC) design, advanced packaging and high-value technology to increase the complexity of the country's economy.
KUALA LUMPUR, Jan 22 (Bernama) -- H2O.ai, a pioneer in sovereign artificial intelligence (AI), has signed a memorandum of understanding (MoU) with Singapore’s Certis Group to scale the use of AI, focusing on the deployment of agentic and predictive capabilities in operational environments.
KUALA LUMPUR, Nov 26 (Bernama) -- Huayan Robotics will showcase a new wave of collaborative automation technologies at the International Robot Exhibition (iREX) 2025, taking place Dec 3 to 6 under the theme "Sustainable Societies Through Robotics".
KUALA LUMPUR, Nov 19 (Bernama) -- Any trade agreement signed with any country will not affect Malaysia’s sincere and enduring relationship with Beijing, said Deputy Prime Minister Datuk Seri Dr Ahmad Zahid Hamidi.
KUALA LUMPUR, Nov 14 (Bernama) -- The healthcare and insurance/takaful industries have reactivated the Grievance Mechanism Committee (GMC) with the support of the Health Ministry and Bank Negara Malaysia, bringing together medical professionals, hospitals, insurers, takaful operators, and regulators to address systemic claims challenges.
By Zufazlin Baharuddin
KUALA LUMPUR, Nov 9 (Bernama) -- The upcoming upgrade of the ASEAN-India Trade in Goods Agreement (AITIGA) and expanding semiconductor collaboration with India are expected to shape the next phase of ASEAN-India economic ties, an analyst said.
KUALA LUMPUR, Nov 4 (Bernama) -- HERE Technologies, the leading location data and technology platform, has announced a strategic alliance with Amap, China’s navigation provider, to co-develop advanced, artificial intelligence (AI)-driven navigation and digital cockpit solutions for Chinese automotive brands.
KUALA LUMPUR, Nov 3 (Bernama) -- The Malaysian Investment Development Authority (MIDA), in collaboration with Hyundai Motor Malaysia, has organised a five-day programme to strengthen localisation, enhance vendors’ technical expertise, and support Malaysia’s transition to a new energy ecosystem.
KUALA LUMPUR, Oct 27 (Bernama) -- CelcomDigi Bhd has inked a memorandum of understanding (MoU) with Terengganu Incorporated Sdn Bhd to drive digitalisation and artificial intelligence (AI) adoption across the group.
KUALA LUMPUR, Oct 22 (Bernama) -- The Advanced Semiconductor Academy of Malaysia (ASEM) and the Indian Institute of Technology Madras (IIT Madras Global) has forged a strategic partnership to strengthen Malaysia’s global positioning and resilience in the semiconductor value chain.
