There are 115 news based on search keyword " packaging"

Malaysia’s Leadership Sought To Spearhead ASEAN Semiconductor Industry Alliance

By Nur Athirah Mohd Shaharuddin

KUALA LUMPUR, May 22 (Bernama) -- Semiconductor industries within Southeast Asia must join forces to compete as a united bloc to elevate ASEAN’s collective role in the global semiconductor value chain.

MIDA Introduces Two Programmes At SEMICON SEA 2025 To Boost International Partnerships

KUALA LUMPUR, May 21 (Bernama) -- Malaysia Investment Development Authority (MIDA) introduced two strategic programmes at SEMICON South East Asia (SEA) 2025 to accelerate industry growth and foster international partnerships.

Nearfield Instruments, A*STAR IME To Advance AI Chip Metrology In Singapore

KUALA LUMPUR, May 21 (Bernama) -- Nearfield Instruments, a leader in advanced semiconductor metrology, has entered a multi-year research collaboration with Singapore’s A*STAR Institute of Microelectronics (A*STAR IME) to drive innovation in semiconductor metrology technologies.

Mamee Unveils New Look On Daebak Korean Sauces Tailored For Malaysian Taste Buds

PETALING JAYA, May 20 (Bernama) -- Mamee-Double Decker Distribution (M) Sdn Bhd has introduced a refreshed lineup of its DAEBAK Korean sauces, featuring revamped packaging designed to appeal to Malaysian tastes.

Anwar Warns Rising Protectionism Threatens Global Trading System

KUALA LUMPUR, May 15 (Bernama) – Prime Minister Datuk Seri Anwar Ibrahim has warned that unilateral actions and the rise of protectionism by economic superpowers go against the grain of free trade and threaten the entire global trading system, especially small developing economies. 

Malaysia To Boost Semiconductor Expertise As US Rescinds Chip Export Curbs

KUALA LUMPUR, May 12 (Bernama) -- Malaysia can have greater access to more advanced semiconductor chips following Washington’s move to rescind curbs on chip exports, a move that can propel it to move beyond its current strength in midstream packaging and testing into higher-value upstream chip design.

Malaysia, Arm Rev Up IC Design Capabilities For Local Companies Via Engagement Session

PUCHONG, May 6 (Bernama) -- The Malaysia Semiconductor IC Design Park, in collaboration with the semiconductor company Arm, today kicked off its engagement session with over 20 local companies in its effort to shift Malaysia towards front-end integrated circuit (IC) microchip design. 

Malaysia Can Be Catalyst For ASEAN-China Semiconductor, Infrastructure Integration - Economist

By Kisho Kumari Sucedaram 

BEIJING, April 24 (Bernama) -- Malaysia holds a strong potential to serve as a regional catalyst in semiconductor innovation and infrastructure connectivity, offering a strategic gateway for enhanced ASEAN-China economic integration. 

Thailand Eyes Halal Sector To Deepen Economic Ties With Malaysia — Thai Chamber Of Commerce

KUALA LUMPUR, April 22 (Bernama) -- The Thai Chamber of Commerce views the halal sector as a promising platform for deeper economic collaboration between Thailand and Malaysia.

Seven Shows, One Creative Hub: HKTDC Puts Hong Kong In The Spotlight

KUALA LUMPUR, April 21 (Bernama) -- The Hong Kong Trade Development Council (HKTDC) is staging seven mega events, spanning lifestyle products and the licensing sector, this month, spotlighting Hong Kong's role as a creative and innovation hub.

Sustainability Report: LyondellBasell Showcases Progress In Circular Economy, Climate Action

KUALA LUMPUR, April 16 (Bernama) -- LyondellBasell, a global leader in the chemical industry, has demonstrated progress in circular and low-carbon solutions, climate action and operational excellence with the release of its 2024 Sustainability Report.

E&E Sector To Grow, Tracking Rising Demand For High-Precision Components

KUALA LUMPUR, March 26 (Bernama) -- The electrical and electronic (E&E) sector is expected to grow this year, driven by the rising demand for high-precision electronic components, said Chemlite Innovation Bhd.