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There are 29 news based on search keyword " wafer"

No Major Changes In Us-Malaysia Economic Relations - Ambassador

GEORGE TOWN, Dec 5 (Bernama) -- There will not be any major changes in the economic relations between the United States (US) and Malaysia under the new leadership, said US Ambassador to Malaysia Edgard D Kagan.

NIMP 2030 Succeeds In Raising Value Added, Jobs, Median Salary In Manufacturing Sector -- Tengku Zafrul

KUALA LUMPUR, Oct 21 (Bernama) -- The Investment, Trade and Industry Ministry (MITI) is confident of achieving the first-year targets of the New Industrial Master Plan 2030 (NIMP 2030), having already fulfilled three of the main indicators set, according to its minister Tengku Datuk Seri Zafrul Abdul Aziz.

Imminent Surge In US Power Demand Challenges Utilities Companies - Wood Mackenzie 

KUALA LUMPUR, Oct 18 (Bernama) -- Wood Mackenzie in its latest Horizons report revealed that the United States (US) power demand is set to soar for the first time in decades, with growth between four per cent and 15 per cent through 2029, depending on the region.

UMC, Ngee Ann Polytechnic Team Up To Amplify Semiconductor Talent Pipeline

KUALA LUMPUR, Oct 1 (Bernama) -- United Microelectronics Corporation (UMC), a global semiconductor foundry, has signed a memorandum of understanding (MoU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the growing semiconductor industry.

Teledyne Launches 16k TDI Line Scan Camera With 1 Megahertz Line Rate

KUALA LUMPUR, Sept 19 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company, has introduced the Linea HS2 TDI line scan camera family, representing a significant breakthrough in next generation time delay and integration (TDI) technology.