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KUALA LUMPUR, Oct 1 (Bernama) -- United Microelectronics Corporation (UMC), a global semiconductor foundry, has signed a memorandum of understanding (MoU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the growing semiconductor industry.
KUALA LUMPUR, Sept 19 (Bernama) -- Teledyne DALSA, a Teledyne Technologies company, has introduced the Linea HS2 TDI line scan camera family, representing a significant breakthrough in next generation time delay and integration (TDI) technology.
