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There are 173 news based on search keyword " packaging"

Taiwan Eyes Stronger Cooperation In High-Tech Supply Chain With Malaysia

By Durratul Ain Ahmad Fuad

KUALA LUMPUR, May 12 (Bernama) -- Taiwan is seeking to strengthen cooperation with Malaysia in the high-tech supply chain, particularly in the electrical and electronics (E&E) sector, including semiconductors and artificial intelligence (AI).

RCEP Must Pivot To High-complexity Trade And Integrated Supply Chains

HAIKOU (China), May 12 (Bernama) -- The Regional Comprehensive Economic Partnership (RCEP) must evolve beyond traditional tariff reductions and simple transhipment towards high-complexity trade and integrated supply chains.

Bursa Malaysia Opens Higher, Tracking Wall Street Gains

KUALA LUMPUR, May 12 (Bernama) -- Bursa Malaysia opened higher on Tuesday, mirroring Wall Street’s positive overnight performance amid expectations of spillover buying interest into the FTSE Bursa Malaysia KLCI (FBM KLCI).

Three Local Companies Approved For Access To Arm Ltd's Technology - Akmal

PUTRAJAYA, May 11 (Bernama) -- The government has extended offers under the strategic collaboration between the Malaysian government and Arm Ltd to three local companies as part of efforts to strengthen the nation’s capabilities in integrated circuit (IC) design.

Global Crisis: Economy Ministry Focusing On Strengthening Economic Resilience

BATU KAWAN, May 8 (Bernama) -- The Economy Ministry is focusing on efforts to strengthen the nation’s economic resilience and safeguard the supply of key input materials amidst the ongoing global uncertainty and crises.

Malaysia Aims To Build Advanced Semiconductor Packaging In Two Years

BATU KAWAN, May 8 (Bernama) -- Malaysia aims to develop domestic capability in advanced semiconductor packaging within two years through the establishment of the Malaysia Advanced Packaging Consortium (MAPC).

Malaysia Eyes Leadership In Advanced Packaging As AI Reshapes Global Chip Industry

KUALA LUMPUR, May 8 (Bernama) -- Malaysia is positioning itself to move beyond its long-standing leadership in assembly, testing and packaging towards leadership in advanced packaging as artificial intelligence (AI) reshapes the global semiconductor industry.

MIDA Pushes Deeper Local Participation In Semiconductor Value Chains

KUALA LUMPUR, May 7 (Bernama) -- Malaysia must continue attracting strategic, high-quality investments while ensuring that local companies capture greater share of the value created by global investors operating in the country, said Malaysian Investment Development Authority (MIDA) chief executive officer Datuk Sikh Shamsul Ibrahim Sikh Abdul Majid.

MIDA Strengthens Semiconductor Ecosystem Via Talent Development

KUALA LUMPUR, May 7 (Bernama) -- The Malaysian Investment Development Authority (MIDA) is strengthening Malaysia’s semiconductor ecosystem through a strategic focus on talent development, smart manufacturing and supply chain integration in conjunction with SEMICON Southeast Asia 2026.

Taiwan Looks To Deepen Data Centre, Robotics Collaboration With Malaysia

By Abdul Hamid A Rahman

KUALA LUMPUR, May 6 (Bernama) -- Taiwan is looking to strengthen collaboration with Malaysia in the semiconductor and smart manufacturing sectors, particularly in data centres and robotics, by leveraging the complementary strengths of both economies across the semiconductor value chain.

Japan, Malaysia Must Work Even Closer To Elevate Industrial Cooperation -- Envoy

KUALA LUMPUR, May 4 (Bernama) -- Japan and Malaysia must work even more closely to elevate industrial cooperation, seize new opportunities and build resilience in an uncertain global environment.

Fraser & Neave 2Q Net Profit Down To RM96.27 Mln Vs RM140.33 A Year Ago

KUALA LUMPUR, April 30 (Bernama) -- Fraser & Neave Holdings Bhd’s (F&N) net profit for the second quarter ended March 31, 2026 (2Q 2026) eased to RM96.27 million versus RM140.33 million a year ago.