JOHOR BAHRU, April 1 (Bernama) -- Shanghai-based global technology company LongCheer Technology is planning an investment of about RM500 million which is expected to create 200 highly skilled job opportunities in Johor.
KUALA LUMPUR, March 31 (Bernama) -- Cyber risk remains the foremost concern for financial institutions amid increasingly sophisticated cyber threats, and the operational, financial and reputational implications in 2026, according to the Bank Negara Malaysia.
KUALA LUMPUR, March 26 (Bernama) -- Foremay Inc, a global leader in space-grade and military-grade solid-state drives (SSD), announced the launch of its groundbreaking InterStellar series, a full line of radiation-hardened SSD drives.
KUALA LUMPUR, March 26 (Bernama) -- The government will intensify support for domestic drug production to contain costs under the New Industrial Master Plan (NIMP 2030), according to research firm BMI.
By Engku Shariful Azni Engku Ab Latif
KUALA LUMPUR, March 26 (Bernama) -- As Malaysia’s 5G rollout seeks to balance technological advancement with readiness, Huawei Technologies (Malaysia) Sdn Bhd (Huawei Malaysia) has stepped up its talent development efforts to support effective implementation in the digital era.
KUALA LUMPUR, March 24 (Bernama) -- Artel Video, a brand of Patton, has unveiled the FiberLink ST2110-TD, a rugged, compact, portable gateway enabling real-time conversion between 3G/HD-SDI and SMPTE ST 2110 Internet Protocol (IP) video signals.
KUALA LUMPUR, March 19 (Bernama) -- Refeyn, a pioneering mass photometry technology developer, has launched the MyMass mass photometer (MyMassMP), a compact instrument designed to simplify sample quality assessment for structural biology.
KUALA LUMPUR, March 18 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has commenced volume shipments of the "TLX9920", a new photovoltaic-output photocoupler targeting solid state relays (SSR) in automotive equipment.
KUALA LUMPUR, March 18 (Bernama) -- K-Tech Solutions Company Limited (K-Tech) has signed a memorandum of understanding with Boardware Intelligence Technology Limited (Boardware), becoming the exclusive hardware development and engineering partner for Boardware’s artificial intelligence (AI) and Brain-Computer Interface (BCI) product platform.
KUALA LUMPUR, March 17 (Bernama) -- Helical Fusion Co Ltd, a Japanese fusion energy company, has announced the construction site for Phase 1 of Helix HARUKA, its Integrated Demonstration Device.
By Niam Seet Wei
KUALA LUMPUR, March 17 (Bernama) -- Integrated refurbished technology leader CompAsia Sdn Bhd is set to launch its Main Market initial public offering (IPO) on Bursa Malaysia in the first half of 2027 (1H 2027), aiming to raise around RM400 million to RM500 million, with a valuation of about RM2 billion.
KUALA LUMPUR, March 12 (Bernama) -- Xsolla, a global video game commerce company, has released the latest edition of The Xsolla Report, offering insights into emerging opportunities in the gaming industry.
