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There are 26 news based on search keyword " chip design"

Economists Cautious On Malaysia’s 2025 Trade Prospects Amid Tariff Uncertainty

By Siti Noor Afera Abu

KUALA LUMPUR, June 22 (Bernama) -- Economists are maintaining a cautious stance on Malaysia’s trade outlook this year due to persistent global tariff uncertainty, which is expected to weigh on the country’s trade and manufacturing performance.

Taiwan Eyes Deeper ICT Collaboration With Malaysia - TAITRA

KUALA LUMPUR, June 10 (Bernama) -- Taiwan is well positioned to support Malaysia in developing data centres, particularly in the area of information and communications technology (ICT), said Taiwan External Trade Development Council (TAITRA) deputy executive director Keven Cheng. 

MIDA Introduces Two Programmes At SEMICON SEA 2025 To Boost International Partnerships

KUALA LUMPUR, May 21 (Bernama) -- Malaysia Investment Development Authority (MIDA) introduced two strategic programmes at SEMICON South East Asia (SEA) 2025 to accelerate industry growth and foster international partnerships.

Malaysia To Boost Semiconductor Expertise As US Rescinds Chip Export Curbs

KUALA LUMPUR, May 12 (Bernama) -- Malaysia can have greater access to more advanced semiconductor chips following Washington’s move to rescind curbs on chip exports, a move that can propel it to move beyond its current strength in midstream packaging and testing into higher-value upstream chip design.

Malaysia Can Be Catalyst For ASEAN-China Semiconductor, Infrastructure Integration - Economist

By Kisho Kumari Sucedaram 

BEIJING, April 24 (Bernama) -- Malaysia holds a strong potential to serve as a regional catalyst in semiconductor innovation and infrastructure connectivity, offering a strategic gateway for enhanced ASEAN-China economic integration. 

Malaysia Semiconductor IC Design Park Strengthens Collaboration With Brazil, AWS

KUALA LUMPUR, April 11 (Bernama) -- Malaysia Semiconductor IC Design Park has established strategic partnerships involving Brazil’s ChipInventor and Amazon Web Services (AWS) with the support of the Embassy of Brazil in Malaysia through the Innovation Diplomacy Programme as well as the Brazilian Ministry of Science, Technology, and Innovation.

MIDA and Arm Ltd Forge Agreement to Boost Malaysia’s Semiconductor Industry

KUALA LUMPUR, March 5 (Bernama) -- Arm Ltd's decision to select Malaysia as its first Southeast Asian partner sets clear objectives that will help elevate the country's semiconductor sector.

Malaysia To Invest US$250 Mln Over Next Decade Via Strategic Collaboration With Arm Holdings

KUALA LUMPUR, March 5 (Bernama) -- Malaysia will invest US$250 million (US$1= RM4.44) over the next decade, leveraging on Arm Holdings Plc's expertise, to create a new ecosystem in the artificial intelligence (AI) and semiconductor industry through a strategic collaboration with the United Kingdom-based company. 

SMD Semiconductor Unveils New Innovations At MWC Barcelona 2025

KUCHING, March 3 (Bernama) -- SMD Semiconductor successfully showcased its latest semiconductor innovations at MWC Barcelona 2025, held from March 3 to 6 at the Fira de Barcelona Gran Via.

MADANI Economy Framework Bearing Fruits, Malaysia To Launch Second Chip Design Park - PM Anwar  

From D. Arul Rajoo

LONDON, Jan 17 (Bernama) -- Prime Minister Datuk Seri Anwar Ibrahim highlighted the success of the MADANI Economy Framework, which was launched in 2023, during his lecture at the London School of Economics (LSE) today.

NVIDIA’s Investments Relevant, Strengthens Malaysia's Position In Chip Supply Chain - Expert

KUALA LUMPUR, Jan 10 (Bernama) -- NVIDIA's significant investments in Malaysia are relevant for the country, as the company focuses on specialised chip architectures, strengthening Malaysia’s position in the global chip supply chain, said an expert.

XPENG Listed On Fortune China's "Tech 50", "China 500" For Leading AI Mobility Innovation

KUALA LUMPUR, Nov 1 (Bernama) -- XPENG, a Chinese high-technology car company, has secured places on both the "Fortune Tech 50" and "Fortune China 500" lists, reaffirming its competitive advantage and status as a leader in technological innovation.