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KUALA LUMPUR, May 21 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has started shipping test samples of “TW007D120E”, a 1200-volt (V) trench-gate silicon carbide (SiC) MOSFET designed for power supply systems in next-generation artificial intelligence (AI) data centres.
KUALA LUMPUR, May 20 (Bernama) -- InterSystems announced that its electronic health record (EHR) solutions have received Class IIa Medical Devices certification under the European Union (EU) Medical Device Regulation (MDR) 2017/745.
KUALA LUMPUR, May 20 (Bernama) -- Arteris Inc announced its semiconductor system intellectual property (IP) technology has been deployed by Li Auto Inc to support artificial intelligence (AI) compute data movement and systems-on-chip (SoCs) integration for the automaker’s next-generation smart vehicle platforms, beginning with the new L9 Livis SUV.
KUALA LUMPUR, May 19 (Bernama) -- ITC Infotech, a global technology services and solutions provider, and InsureMO have formed a strategic alliance to help insurers accelerate modernisation through agentic artificial intelligence (AI), initially targeting markets in the Middle East, Africa and India.
KUALA LUMPUR, May 15 (Bernama) -- Kioxia Corporation, a world leader in memory solutions, has collaborated with Dell Technologies to deliver a 2U server configuration capable of scaling to an unprecedented 9.8 petabytes (PB) of flash storage.
KUALA LUMPUR, May 13 (Bernama) -- Green Building Initiative (GBI) has announced the planned departure of its Chief Executive Officer (CEO), Vicki Worden, who is set to leave in late June after leading the nonprofit organisation since 2015.
KUALA LUMPUR, May 11 (Bernama) -- Quantum Motion announced a US$160 million Series C funding round to commercialise its silicon transistor-based quantum computing technology designed for scalable and energy-efficient deployment. (US$1 = RM3.91)
KUALA LUMPUR, May 8 (Bernama) -- Digital twin technology and smart manufacturing are becoming increasingly important in strengthening Malaysia’s industrial ecosystem, according to the Malaysian Investment Development Authority (MIDA).
KUALA LUMPUR, May 8 (Bernama) -- Malaysia is positioning itself to move beyond its long-standing leadership in assembly, testing and packaging towards leadership in advanced packaging as artificial intelligence (AI) reshapes the global semiconductor industry.
KUALA LUMPUR, May 5 (Bernama) -- Malaysian Investment Development Authority (MIDA) inked an agreement with AIXTRON SE, a provider of deposition equipment for the semiconductor industry, to build a new greenfield manufacturing facility in Penang at SEMICON Southeast Asia 2026.
KUALA LUMPUR, April 29 (Bernama) -- HOK has announced the acquisition of ROSSETTI, a Detroit-based architecture firm, to strengthen its position as one of the leading sports, recreation and entertainment design practices.
PUTRAJAYA, April 26 (Bernama) -- The current global economic challenges, compounded by geopolitical tensions, require Malaysia to recalibrate its priorities amid heightened uncertainty, said Prime Minister Datuk Seri Anwar Ibrahim.
