Lantronix Integrates AI-enabled Camera Solutions With Teledyne FLIR Thermal
KUALA LUMPUR, March 5 (Bernama) -- Lantronix Inc has announced a major advancement in artificial intelligence (AI)-powered camera technology by integrating its Open-Q System-on-Module (SoM) solutions with Teledyne FLIR’s thermal infrared camera modules and Prism embedded software.
In a statement, Lantronix said this integration accelerates the development of next-generation AI-enabled camera solutions in autonomous navigation/drones, surveillance, and robotics.
“With Lantronix’s Open-Q SoMs, developers can confidently build AI-powered solutions knowing they are backed by industry-leading embedded compute technologies that deliver longevity, reliability, and continuous innovation.
“By integrating with Teledyne FLIR’s advanced thermal camera modules, Lantronix provides a turnkey embedded AI solution that maximises performance while simplifying development and deployment,” said Lantronix Chief Strategy Officer, Mathi Gurusamy.
Powered by Lantronix’s cutting-edge Open-Q SoMs, based on the Qualcomm Dragonwing QRB5165 and QCS8250 processor platforms, this solution delivers unparalleled processing capabilities for AI-driven situational awareness, advanced computational imaging, and real-time decision-making.
Lantronix’s seamless technology integration provides a competitive edge, enabling developers to create high-performance, size-, weight-, and power-optimised (SWaP) AI camera solutions that push the boundaries of innovation.
The company’s integration of Teledyne FLIR Prism into the Qualcomm Dragonwing QRB5165 and QCS8250 platforms brings advanced thermal image signal processing (ISP) and AI capabilities to edge devices.
-- BERNAMA