KUALA LUMPUR, March 23 (Bernama) -- Toshiba Electronic Devices & Storage Corporation (Toshiba) has expanded its line-up of SO6L IC-output photocouplers with a new wide leadform package type SO6L(LF4), with the shipments starting yesterday.
The SO6L(LF4) photocouplers package has a creepage distance of eight millimetres (mm), which meets the industry's standard creepage distance for SO6L.
The package is footprint-compatible with the SDIP6(F type) package with wide lead-forming option and a maximum package height of 4.15 mm.
The package has a maximum height of 2.3 mm, approximately 45 per cent thinner than the conventional SDIP6(F type) package, with the low profile package contributing to system size reduction and can be mounted in height-restricted locations, such as the back of a board.
To date, Toshiba has offered eight photocouplers in the SO6L(LF4) package, of which three are for high-speed communication applications and five for IGBT/MOSFET drive applications.
Now the company has added six photocouplers in the SO6L(LF4) package to its product portfolio - three for high-speed communication applications and three for IGBT/MOSFET drive applications.
Toshiba, in a statement, said it would release more IC-output photocouplers as direct replacements for the current SDIP6(F type) package.
Toshiba Electronic Devices & Storage Corporation is among the leading general devices companies which offer their customers and business partners outstanding solutions in discrete semiconductors, system LSIs and HDD.
More about Toshiba at toshiba.semicon-storage.com/ap-en/company.html.